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MOTOROLA
Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
Order this document by MPX2202/D
200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors
The MPX2202/MPXV2202G device series is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output -- directly proportional to the applied pressure. The sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. They are designed for use in applications such as pump/motor controllers, robotics, level indicators, medical diagnostics, pressure switching, barometers, altimeters, etc. Features UNIBODY PACKAGE * Temperature Compensated Over 0C to +85C * Easy-to-Use Chip Carrier Package Options * Available in Absolute, Differential and Gauge Configurations Application Examples * Pump/Motor Controllers * Robotics MPX2202A/D CASE 344 * Level Indicators * Medical Diagnostics * Pressure Switching * Barometers * Altimeters Figure 1 illustrates a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
VS 3 THIN FILM TEMPERATURE COMPENSATION AND CALIBRATION CIRCUITRY 1 GND
MPX2202 MPXV2202G SERIES
Motorola Preferred Device
0 to 200 kPa (0 to 29 psi) 40 mV FULL SCALE SPAN (TYPICAL)
Freescale Semiconductor, Inc...
SMALL OUTLINE PACKAGE SURFACE MOUNT
MPXV2202GP CASE 1369
2 4
SENSING ELEMENT
Vout+ Vout-
MPX2202AP/GP CASE 344B MPXV2202DP CASE 1351
PIN NUMBER
1 2 MPX2202DP CASE 344C 3 4 Gnd +Vout VS -Vout 5 6 7 8 N/C N/C N/C N/C
Figure 1. Temperature Compensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The differential voltage output of the sensor is directly proportional to the differential pressure applied. The absolute sensor has a built-in reference vacuum. The output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (P1) side. The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (P1) side relative to the vacuum (P2) side. Similarly, output voltage increases as increasing vacuum is applied to the vacuum (P2) side relative to the pressure (P1) side.
Preferred devices are Motorola recommended choices for future use and best overall value.
NOTE: Pin 1 is noted by the notch in the lead.
MPX2202ASX/GSX CASE 344F
PIN NUMBER
1 2 Gnd +Vout 3 4 VS -Vout MPX2202GVP CASE 344D
Replaces MPX2200/D REV 2
NOTE: Pin 1 is noted by the notch in the lead.
Motorola Sensor Device Data (c) Motorola, Inc. 2002
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Freescale MPX2202 MPXV2202G SERIES
MAXIMUM RATINGS(NOTE)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature
Semiconductor, Inc.
Symbol Pmax Tstg TA Value 800 -40 to +125 -40 to +125 Unit kPa C C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristics Pressure Range(1) Supply Voltage Supply Current Full Scale Span(3) Offset(4) Symbol POP VS Io VFSS Voff V/P MPX2202D Series MPX2202A Series Hysteresis(5) -- -- -- TCVFSS TCVoff Zin Zout tR -- -- Min 0 -- -- 38.5 -1.0 -- -0.6 -1.0 -- -- -2.0 -1.0 1000 1400 -- -- -- Typ -- 10 6.0 40 -- 0.2 -- -- 0.1 0.5 -- -- -- -- 1.0 20 0.5 Max 200 16 -- 41.5 1.0 -- 0.4 1.0 -- -- 2.0 1.0 2500 3000 -- -- -- Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV ms ms %VFSS
Freescale Semiconductor, Inc...
Sensitivity Linearity(5)
Pressure Hysteresis(5) (0 to 200 kPa) Temperature (-40C to +125C) Temperature Effect on Full Scale Span(5) Temperature Effect on Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm-Up Offset Stability(7) Offset(5)
NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
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Motorola Sensor Device Data
Freescale Semiconductor, MPX2202 MPXV2202G SERIES Inc.
LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.
LEAST SQUARES FIT RELATIVE VOLTAGE OUTPUT EXAGGERATED PERFORMANCE CURVE LEAST SQUARE DEVIATION STRAIGHT LINE DEVIATION
END POINT STRAIGHT LINE FIT
OFFSET 0 50 PRESSURE (% FULLSCALE) 100
Freescale Semiconductor, Inc...
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the MPX2202/MPXV2202G series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on Full Scale Span and Offset are very small and are shown under Operating Characteristics.
40 35 OUTPUT (mVdc) 30 25 20 15 10 5 0 -5 kPa 0 PSI
VS = 10 Vdc TA = 25C P1 > P2 MAX
TYP
SPAN RANGE (TYP) MIN
25
50 7.25
75
100 14.5 PRESSURE
125
150 21.75
175
200 29
OFFSET
Figure 3. Output versus Pressure Differential
SILICONE GEL DIE COAT WIRE BOND
WIRE BOND
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT P2
DIE BOND
LEAD FRAME
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the differential or gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2202/MPXV2202G series pressure sensor oper-
ating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
Motorola Sensor Device Data
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EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE EEEEEEEEEEE
ABSOLUTE ELEMENT P2
DIFFERENTIAL/GAUGE STAINLESS STEEL DIE METAL COVER P1 EPOXY CASE
SILICONE GEL ABSOLUTE DIE COAT DIE P1
STAINLESS STEEL METAL COVER EPOXY CASE
EEEEEEEEEEEE EEEEEEEEEEEE EEEEEEEEEEEE EEEEEEEEEEEE
DIE BOND
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Freescale MPX2202 MPXV2202G SERIES
Semiconductor, Inc.
tial pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below:
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die from the environment. The differential or gauge sensor is designed to operate with positive differenPart Number MPX2202A MPX2202DP MPX2202AP MPX2202GVP MPX2202ASX MPXV2202GP MPX2202GSX MPX2202GP MPX2202D
Case Type 344 344C 344B 344D 344F 1369 1351
Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Stainless Steel Cap Side with Port Attached Side with Port Attached Side with Part Marking
Freescale Semiconductor, Inc...
MPXV2202DP
ORDERING INFORMATION -- UNIBODY PACKAGE (MPX2202 SERIES)
MPX Series Device Type Basic Element Ported Elements Options Absolute, Differential Differential, Dual Port Absolute, Gauge Absolute, Gauge Axial Gauge, Vacuum Case Type 344 344C 344B 344F 344D Order Number MPX2202A MPX2202D MPX2202DP MPX2202AP MPX2202GP MPX2202ASX MPX2202GSX MPX2202GVP Device Marking MPX2202A MPX2202D MPX2202DP MPX2202AP MPX2202GP MPX2202A MPX2202D MPX2202GVP
ORDERING INFORMATION -- SMALL OUTLINE PACKAGE (MPXV2202G SERIES)
Device Type Ported Elements Options Gauge, Side Port, SMT Differential, Dual Port, SMT Case No. 1369 1351 MPX Series Order No. MPXV2202GP MPXV2202DP Packing Options Trays Trays Marking MPXV2202G MPXV2202G
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Motorola Sensor Device Data
Freescale Semiconductor, MPX2202 MPXV2202G SERIES Inc.
SMALL OUTLINE PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
Freescale Semiconductor, Inc...
B
E1
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.300 0.330 0.002 0.010 0.038 0.042 0.465 0.485 0.717 BSC 0.465 0.485 0.100 BSC 0.245 0.255 0.120 0.130 0.061 0.071 0.270 0.290 0.080 0.090 0.009 0.011 0.115 0.125 0 7 MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 18.21 BSC 11.81 12.32 2.54 BSC 6.22 6.47 3.05 3.30 1.55 1.80 6.86 7.36 2.03 2.28 0.23 0.28 2.92 3.17 0 7
T
N K
A
8X
M
P
0.004 (0.1)
SEATING PLANE
DETAIL G C
CASE 1369-01 ISSUE O
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Freescale MPX2202 MPXV2202G SERIES
Semiconductor, Inc.
SMALL OUTLINE PACKAGE DIMENSIONS--CONTINUED
2 PLACES 4 TIPS
0.006 (0.15) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
Freescale Semiconductor, Inc...
B
E1
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.
GND +Vout Vs -Vout N/C N/C N/C N/C
STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.
N/C Vs GND Vout N/C N/C N/C N/C
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.370 0.390 0.002 0.010 0.038 0.042 0.465 0.485 0.680 0.700 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.270 0.290 0.160 0.180 0.009 0.011 0.110 0.130 0 7 MILLIMETERS MIN MAX 9.39 9.91 0.05 0.25 0.96 1.07 11.81 12.32 17.27 17.78 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 6.86 7.37 4.06 4.57 0.23 0.28 2.79 3.30 0 7
N
T
A
M
P
8X
0.004 (0.1)
SEATING PLANE
DETAIL G C
K
CASE 1351-01 ISSUE O
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Motorola Sensor Device Data
Freescale Semiconductor, MPX2202 MPXV2202G SERIES Inc.
UNIBODY PACKAGE DIMENSIONS
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MIN MAX 0.595 0.630 0.514 0.534 0.200 0.220 0.016 0.020 0.048 0.064 0.100 BSC 0.014 0.016 0.695 0.725 30 _ NOM 0.475 0.495 0.430 0.450 0.048 0.052 0.106 0.118 MILLIMETERS MIN MAX 15.11 16.00 13.06 13.56 5.08 5.59 0.41 0.51 1.22 1.63 2.54 BSC 0.36 0.40 17.65 18.42 30 _ NOM 12.07 12.57 10.92 11.43 1.22 1.32 2.68 3.00
C R M
1
B
-A- N
PIN 1
1 2 3 4
2
3
4
Z
L
-T- J
SEATING PLANE
G F
4 PL
F Y
D
0.136 (0.005)
M
TA
M
DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL
DIM A B C D F G J L M N R Y Z
Freescale Semiconductor, Inc...
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
STYLE 2: PIN 1. 2. 3. 4.
VCC - SUPPLY + SUPPLY GROUND
STYLE 3: PIN 1. 2. 3. 4.
GND -VOUT VS +VOUT
CASE 344-15 ISSUE Z
SEATING PLANE
-T- R H N
PORT #1 POSITIVE PRESSURE (P1)
-A- U L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC
-Q-
B
PIN 1
12 34
K S F G D 4 PL 0.13 (0.005)
-P- 0.25 (0.010) J C
M
TQ
S
M
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344B-01 ISSUE B
Motorola Sensor Device Data
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UNIBODY PACKAGE DIMENSIONS -- CONTINUED
V R
PORT #2 PORT #1
-A- U W H
PORT #2 VACUUM (P2)
L
PORT #1 POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.145 1.175 0.685 0.715 0.405 0.435 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.159 0.063 0.083 0.220 0.240 0.910 BSC 0.248 0.278 0.310 0.330 MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 10.29 11.05 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 1.60 2.11 5.59 6.10 23.11 BSC 6.30 7.06 7.87 8.38
N
-Q-
SEATING PLANE
B
SEATING PLANE PIN 1
1234
-P- -T- J -T- C 0.13 (0.005)
M
K
S
0.25 (0.010)
M
TQ
S G D 4 PL
F
Freescale Semiconductor, Inc...
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344C-01 ISSUE B
-A- -T- R N -Q-
SEATING PLANE PORT #2 VACUUM (P2)
U L H
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.145 1.175 0.685 0.715 0.305 0.325 0.016 0.020 0.048 0.064 0.100 BSC 0.182 0.194 0.014 0.016 0.695 0.725 0.290 0.300 0.420 0.440 0.153 0.159 0.153 0.158 0.230 0.250 0.220 0.240 0.910 BSC MILLIMETERS MIN MAX 29.08 29.85 17.40 18.16 7.75 8.26 0.41 0.51 1.22 1.63 2.54 BSC 4.62 4.93 0.36 0.41 17.65 18.42 7.37 7.62 10.67 11.18 3.89 4.04 3.89 4.04 5.84 6.35 5.59 6.10 23.11 BSC
B
12 34
K S
PIN 1
C J -P- 0.25 (0.010)
M
F TQ
S
G D 4 PL 0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344D-01 ISSUE B
8
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Motorola Sensor Device Data
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UNIBODY PACKAGE DIMENSIONS -- CONTINUED
-T- C E A U -Q-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G J K N P Q R S U V INCHES MIN MAX 1.080 1.120 0.740 0.760 0.630 0.650 0.016 0.020 0.160 0.180 0.048 0.064 0.100 BSC 0.014 0.016 0.220 0.240 0.070 0.080 0.150 0.160 0.150 0.160 0.440 0.460 0.695 0.725 0.840 0.860 0.182 0.194 MILLIMETERS MIN MAX 27.43 28.45 18.80 19.30 16.00 16.51 0.41 0.51 4.06 4.57 1.22 1.63 2.54 BSC 0.36 0.41 5.59 6.10 1.78 2.03 3.81 4.06 3.81 4.06 11.18 11.68 17.65 18.42 21.34 21.84 4.62 4.92
V
N R
PORT #1 POSITIVE PRESSURE (P1)
B
-P- 0.25 (0.010)
M
PIN 1
TQ
M
4
3
2
1
S K
Freescale Semiconductor, Inc...
J
F D 4 PL 0.13 (0.005)
G TP Q
STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT
M
S
S
CASE 344F-01 ISSUE B
Motorola Sensor Device Data
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Freescale MPX2202 MPXV2202G SERIES
Semiconductor, Inc.
NOTES
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Motorola Sensor Device Data
Freescale Semiconductor, MPX2202 MPXV2202G SERIES Inc.
NOTES
Freescale Semiconductor, Inc...
Motorola Sensor Device Data
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Semiconductor, Inc.
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Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 Technical Information Center: 1-800-521-6274 HOME PAGE: http://www.motorola.com/semiconductors/
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